Thermal Management of Big Chip LEDs

https://download.luminus.com/datasheets/Luminus_APN-001443_Rev_04.pdf

Big Chip LEDs have been engineered from the ground up to provide the industry’s lowest package thermal resistance. This incredibly low thermal resistance - 0.73 ºC/W from junction to heat sink for the CBT and PT120 modules - enables unprecedented input power and flux emitted from the
LED. As a result, a new class of LEDs has been created, enabling lighting designers to build the next generation of lighting products. This application note serves to provide the designer with the tools
necessary to create an efficient, well designed thermal system around Big Chip LEDs. The general theory of thermal design, as well as practical methodology for managing the thermal system around Big Chip LEDs is discussed.

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